Disco
Usage:
Ultra-thin cutting wheel designed for precision slicing and high-accuracy cutting applications.
Materials:
Silicon, sapphire, ceramics, glass.
Applications:
Semiconductor wafer dicing, substrate cutting, and optical glass processing.
Usage:
Ultra-thin cutting wheel designed for precision slicing and high-accuracy cutting applications.
Materials:
Silicon, sapphire, ceramics, glass.
Applications:
Semiconductor wafer dicing, substrate cutting, and optical glass processing.
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