Usage:
Metal bond mounted points are manufactured using sintered metal bonds and diamond abrasives, providing excellent durability, shape retention, and grinding performance. They are ideal for shaping, dressing, precision grinding, and small-hole machining applications requiring high dimensional accuracy and long tool life.
Specifications:
Materials:
Quartz, ceramics, glass, sapphire, carbide, superalloys, high-chrome steels, and semiconductor materials.
Applications:
Precision grinding, internal grinding, small-hole machining, jig grinding, profile grinding, dressing operations, semiconductor component processing, semiconductor wafer manufacturing, and precision machining of advanced materials.
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